| Plastic Digital Array Beamformer Development With Integrated High Efficiency Gallium-Nitride MMICs |
Dec-2008 |
9 pages |
| Authors:
J Gregory; C Fulton; A Wegener; B Perlman; W Chappell; PURDUE UNIV LAFAYETTE IN
|
 | With the advent of highly efficient wide bandgap amplifiers, there is the possibility of generating high power outputs without using expensive packaging. The goal is to create a plastic panel of integrated radiators which have limited cooling while having an output with a minimum of 25 Watts per element with efficiencies above 60% at die level. Towards this end, the development of highly efficient GaN MMICs and plastic packaging is ... |
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| OPTIMAL ARRAY GEOMETRIES FOR WADEBAND DOA ESTIMATION, |
FEB 2002 |
|
| Authors:
ULKII BAYSAL; Randolph L. Moses; OHIO STATE UNIV COLUMBUS DEPT OF ELECTRICAL ENGINEERING
|
 | (U) THIS PAPER ADDRESSES THE ROLE OF ARRAY GEOMETRY ON THE DIRECTION OF ARRIVAL ESTIMATING PERFORMANCE OF THE ARRAY WHERE THE IMPINGING SIGNAL IS WIDEBAND. THE PAPER CONCENTRATES ON ARRAYS THAT HAVE ISOTROPIC PERFORMANCE, WHOSE CRAMER RAO BOUND ON THE DIRECTION OF ARRIVAL OF A SINGLE SOURCE IS UNIFORM FOR ALL ANGLES. NECESSARY AND SUFFICIENT CONDITIONS ON THE LOCATION OF ARRAY ELEMENTS SO THAT THE ARRAY IS ISOTROPIC ARE DERIVED ... |
|
| ChipSeal Inorganic Sealing Technology for Hermetic-Like Integrated Circuits. Volume 1 |
SEP 2000 |
129 pages |
| Authors:
R. Camilletti; M. Loboda; L. McCoy; DOW CORNING CORP MIDLAND MI
|
| This report summarizes the application and performance data for inorganic protective coatings to be used for hermetic-like sealing of integrated circuits for use in severe environments with or without secondary packaging. |
|
| Inkjet Printing of Flexible Circuits on Polymer Substrate |
18 NOV 1999 |
27 pages |
| Authors:
Chung-tse Chu; MATERIALS RESEARCH INST BEAVERCREEK OH
|
| Flexible printed circuits have a wide range of applications in consumer electronics, computers, automobiles, and space and aerospace vehicles. In this Small Business Technology Transfer (STTR) Phase 1 program, Materials Research Institute (MRI) and University of Dayton Research Institute (UDRI) demonstrated the feasibility of a new processing scheme leading toward the fabrication of high performance, low cost flexible circuits with computer aided design tools ... |
|
| Pulsed Laser-Induced Reactive Processing of CVD-Diamond Substrates UnderLiquid Ambient: A Process for 3-D Multi-Chip Modules |
29 MAR 1999 |
21 pages |
| Authors:
Leonard W. Schaper; Ajay P. Malshe; Hameed Naseem; ARKANSAS UNIV FAYETTEVILLE
|
| Drilling of diamond substrates, using pulsed Nd-YAG laser in water environment showed time efficient processing (about 28 times faster than in an air environment). In addition, better hole uniformity was observed in water environment than in an air environment. In water, the hot laser plasma on the substrate surface generates a reactive oxygen and/or hydrogen environment that increases drilling speed and makes it more uniform size hole. Diamond substrate drilling ... |
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| Scientific and Engineering Semiconductor Device Simulation Tools as a Windows Application |
01 APR 1998 |
6 pages |
| Authors:
H. L. Grubin; SCIENTIFIC RESEARCH ASSOCIATES INC GLASTONBURY CT
|
| A bottleneck associated with numerical simulations of quantum feature size semiconductor devices, has been the absence of a menu driven program that does not require user knowledge of the solution algorithm for the device equations. Under this SBIR study SRA transferred quantum transport algorithms, originally developed for supercomputer simulations to a PC environment. This resulted in (1) program execution via menu based MMicrosoft Windows-type interface, (2) user-defined parameters (dimension, doping, ... |
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| The Fastest Fourier Transform in the West |
11-Sep-1997 |
|
| Authors:
Matteo Frigo; Steven G Johnson; MASSACHUSETTS INST OF TECH CAMBRIDGE
|
| This paper describes FFTW, a portable C package for computing the one- and multidimensional complex discrete Fourier transform "DFT". FFTW is typically faster than all other publicly available DFT software, including the well-known FFTPACK and the code from Numerical Recipes. More interestingly, FFTW is competitive with or better than proprietary, highly-tuned codes such as Sun's PerformanceLibrary and IBM'sESSL library. FFTW implements the Cooley-Tukey fast Fourier transform, and is freely available ... |
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| Methodology, Tools and Demonstration of MCM System Optimization |
31 JUL 97 |
6 pages |
| Authors:
Paul D. Franzon; NORTH CAROLINA STATE UNIV AT RALEIGH
|
| Thin film/solder-bump packaging can be used to improve integrated circuit performance and cost. In this project we (1) designed and built a DES chip to demonstrate the advantages and (2) developed design methodology to support this design style, including appropriate CAD tools. |
|
| Research on Mixed Mode Modules |
APR 97 |
127 pages |
| Authors:
Carmen A. Whitson; STRATEGIC ANALYSIS INC ARLINGTON VA
|
| SA performed research on Mixed Mode Module (MMM) technology spanning the range from applications and mixed mode systems requirements to the baseline technologies which must be put into place to realize MMMs. SA examined promising military applications, and analyzed the critical issues relating to the design, fabrication, and manufacturing of MMMs for advanced electronic systems. SA has defined one such example of a system that incorporates both analog and digital ... |
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| Hybrid Packaging and Integration Methods for Miniature Ultrasound Imaging Array |
JAN 1997 |
|
| Authors:
Clyde G. Oakley; TETRAD CORP ENGLEWOOD CO
|
| The feasibility of building small ultrasound imaging arrays with integrated electronics was explored. These arrays can be used to build laparoscopic, articulated, ultrasound imaging probes for use at forward military surgical locations or in emergency rooms and surgical suites. To achieve this goal, the critical items required are active multiplexer electronics and a multilayer interconnect means which provides for mounting and connection of 128 individual array elements to the imaging ... |
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| High Speed Circuits and Packaging Technology for Advanced Laser Altimeter Systems |
30 DEC 96 |
61 pages |
| Authors:
Charles Chang; Dharmesh Jani; Alfred Yen; K. C. Yang; ROCKWELL INTERNATIONAL ANAHEIM CA SCIENCE CENTER
|
| During this period, significant progress has been made towards the demonstration of the advanced laser altimeter data acquisition unit. Our package design efforts have resulted in a fully functional GaAs chip set for the altimeter system that exceeds the requirement of the 800 Ms/s system and should be able to be used in the 3000 Ms/s system with little or no modifications. The 800 Ms/s data acquisition system design was ... |
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| Stress/Failure Analysis Software for Multi-Material Interfaces |
12 DEC 96 |
42 pages |
| Authors:
Ricardo L. Actis; ENGINEERING SOFTWARE RESEARCH AND DEVELOPMENT INC ST LOUIS MO
|
| An advanced capability for the evaluation of the mechanical strength of electronic components subjected to thermal and mechanical loading in two dimensions has been developed. The implementation is based on recent technological advances which make it possible to determine the natural straining modes and their intensities at singular points associated with multi-material interfaces numerically with a high degree of reliability. The computational techniques were implemented in a two dimensional setting ... |
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| A High-Temperature Printed Circuit Board |
NOV 96 |
19 pages |
| Authors:
Bruce R. Geil; Merle W. DeLancey; ARMY RESEARCH LAB ADELPHI MD
|
| Working with the U.S. Army Space and Strategic Defense Command, the Army Research Laboratory has developed an easy-to-produce, reliable, high- temperature printed circuit board for radiation studies of circuits that use silicon carbide transistors. This board is designed to operate at temperatures beyond 300 deg C. The board consists of an alumina substrate with thick-film gold traces. Stainless-steel pin receptacles are used to mount the transistors, allowing easy insertion and ... |
|
| Integrated Photonics Research. Volume 6 |
17 MAR 96 |
681 pages |
| Authors:
David W. Hennage; OPTICAL SOCIETY OF AMERICA WASHINGTON DC
|
| The integrated photonics research topical meeting presented a complete overview of all experimental and theoretical aspects of integrated and guided wave optics. Some of the topics covered at this meeting were silicon photonics, optical system modeling, simulation of quantum well phenomena, integrated optics and micromachining, parallel optical interconnects and array technology, semiconductor components for fiber in the loop, hybrid packaging of III-V components to single-mode fiber, and components and technologies ... |
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| Reliable Application of Plastic Encapsulated Microcircuits; RAC Parts Seclection, Application and Control Series |
JAN 1996 |
164 pages |
| Authors:
William Denson; John Farrell; David Nicholls; RELIABILITY ANALYSIS CENTER GRIFFISS AFB NY
|
| This report summarizes and analyzes the issues relating to Plastic Encapsulated Microcircuit (PEM) Reliability. Included is: (1) discussion of current research efforts within the government and industry, (2) failure modes and mechanisms associated with PEMs, (3) test data on PEMs subjected to HAST, life test, Autoclave, high temperature storage, 85 deg C/85%RH tests, (4) field reliability data, (5) analysis of both test data and field data, (6) a reliability assessment ... |
|
| Organization of the Integrated Photonics Research Topical Meeting Held in Dana Point, California on February 23 - 25, 1995. Technical Digest Series. Volume 7 |
NOV 95 |
334 pages |
| Authors:
David W. Hennege; OPTICAL SOCIETY OF AMERICA WASHINGTON DC
|
| An agenda of sessions follows: (1) Optoelectronic Devices; (2) Beam Propagation Techniques; (3) Passive Waveguides and Devices; (4) Optoelectronic Modeling; (5) Automation of Optoelectronics Packaging; (6) Time Domain Simulations; (7) Semiconductor Lasers and Amplifiers; (8) Waveguide Modeling Techniques; (9) Rare Earth Doped Materials and Waveguides; (10) Modeling of Waveguide Devices; (11) Robust, Stable, and Manufacturable Optoelectronic Technology; (12) Optoelectronic Modeling; (13) Semiconductor Switches and Modulators; (14) Active Devices; and (15) ... |
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| Electromagnetic Environmental Effects Modeling of Advanced Packaged Modules. |
NOV 1995 |
78 pages |
| Authors:
Daniel J. Kenneally; STANFORD RESEARCH INST MENLO PARK CA
|
| This report presents the results of an investigation of electromagnetic effects in boundary scan and other scan test sturctures embedded as test access ports (TAPs). The TAPs and test scan structures of interest in this study are those used in contemporary ICs and advanced packaged MCMs to enhance testability. This effort addresses the susceptibility issues associated with embedding boundary scan test circuits in MCMs, and its effect on the latent ... |
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| Methods and Components for Optical Contention Resolution in High Speed Networks |
23 FEB 95 |
8 pages |
| Authors:
P. Melman; GTE LABS INC WALTHAM MA
|
| During the sixth quarter of the CORD project, Stanford University has continued experimental investigation of the CORD testbed. The transmission and reception of the 2.488 GHz payload data clock and its affect on the payload data and control channels were investigated. The electronic multiplexer and demultiplexer circuits were tested and measured. The payload data pseudo random data generator and bit error rate measurement logic were designed, components selected, and the ... |
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| Intelligent Finite Element Submodeling of Multichip Modules for Reliability Analysis |
DEC 94 |
122 pages |
| Authors:
Ian R. Grosse; Michael Sheehy; Prasanna Katragadda; Shankar Raman; MASSACHUSETTS UNIV AMHERST DEPT OF MECHANICAL ENGINEERING
|
| Modeling methodologies were developed, implemented, and tested for both rapid thermal finite element analysis of small-scale integrated circuit features in MCMs, and for thermal stress finite element analysis of chip-to- substrate interconnects. A three-step sequential analysis methodology was developed that is initiated with a macroscope thermal analysis of the entire MCM package. The macroscope finite element thermal analysis is then followed by two successive finite element thermal submodels of the ... |
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| Polymer Based Materials for Additive Processing of High Temperature Electronics Packaging |
03 OCT 94 |
3 pages |
| Authors:
Michael Todd; TORANAGA TECHNOLOGIES INC CARLSBAD CA
|
| Work under Task 1 has begun on the evaluation of candidate high temperature transient liquid phase sintering (TLPS) systems as well as candidate high temperature polymer materials. In evaluating candidate metal and alloy systems, binary and available ternary phase diagrams are being reviewed to identify alloy systems that could be used in a high temperature application. The goal is to find a combination of metals and alloys that will go ... |
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| An Investigation of Nonuniform Dose Deposition From an Electron Beam |
AUG 94 |
|
| Authors:
William Lilley; Kieu X. Luu; ARMY RESEARCH LAB ADELPHI MD
|
| in a search for an explanation of nonuniform electron-beam dose deposition, the integrated TIGER Series (ITS) of coupled electron/photon Monte Carlo transport codes was used to calculate energy deposition in the package materials of an application-specific integrated circuit (ASIC) while the thicknesses of some of the materials were varied. The thicknesses of three materials that were in the path of an electron-beam pulse were varied independently so that analysis could ... |
|
| ADC Test Support Program |
30 OCT 93 |
16 pages |
| Authors:
Fred H. Irons; Donald M. Hummels; MAINE UNIV AT ORONO
|
| This report summarizes accomplishments made under Grant No.: N00014- 93-1-1007 for providing ADC Test Support to the ARPA HBT/ADC technology development program during the period of 1 Aug through 30 Oct 93. The following were accomplishments for this period. (1) Attended and participated in a planning meeting at the Mayo Foundation on 19 Jul 93 to discuss testing issues and develop an agenda for the September Workshop; (2) Attended and ... |
|
| JPRS Report Science and Technology Japan |
12 JUL 93 |
|
| Authors:
JOINT PUBLICATIONS RESEARCH SERVICE ARLINGTON VA
|
| This report contains information concerning Japan's science and technology. Specific topics include: (1) optical interconnections, (2) optical subscriber system, (3) packaging technology for ULSI, (4) electrooptical mixed packaging technology, (5) optical mount technology, (6) trends of optical interconnection, (7) optical interconnection technology utilizing space, and (8) microoptics, optical interconnection. |
|
| Construction of a Connectionist Network Supercomputer |
01 MAY 93 |
|
| Authors:
CALIFORNIA UNIV BERKELEY
|
|
| Processing, Fabrication and Demonstration of HTS Integrated Microwave CIrcuits |
25 APR 93 |
|
| Authors:
G. R. Wagner; WESTINGHOUSE ELECTRIC CORP PITTSBURGH PA
|
|
| Special Technology Area Review on Microwave Packaging Technology |
FEB 93 |
41 pages |
| Authors:
Becky Terry; PALISADES INST FOR RESEARCH SERVICES INC ARLINGTON VA
|
| Microwave (MW) and millimeter wave (MMW) multichip module (MCM) packaging is an emerging technology that is of great importance for both defense and commercial applications. Military applications such as radar, electronic warfare, communications, and smart munitions and commercial applications such as communications, direct broadcast satellite, cellular telephone, and automotive electronics all require MW and/or MMW electronics. The spectrum of needs ranges from low volume, high performance electronics to high volume, ... |
|
| Department of Defense Advisory Group on Electron Devices. Special Technology Area Review on Microwave Packaging Technology. Appendix |
FEB 93 |
143 pages |
| Authors:
OFFICE OF THE UNDER SECRETARY OF DEFENSE (ACQUISITION) WASHINGTON DC
|
| Electronic packaging is identified as an area providing opportunity for system performance enhancement for both defense and commercial applications. The move to microwave/millimeter wave multi-chip assemblies with high density interconnects is causing a significant shift in the current practices of how packages are being designed and manufactured. The longer term trend is to move to subsystem or multi-level packaging schemes to achieve higher levels of system integration. Packaging costs are ... |
|
| Applicability of Superconducting Interconnection Technology for High Speed ICs and Systems |
OCT 92 |
|
| Authors:
QUAD DESIGN TECHNOLOGY INC CAMARILLO CA
|
| The extremely low-loss characteristics of HTSC interconnect renders it an attractive candidate for high density-high performance digital circuitry. The purpose of this program was to investigate these properties in detail, and to determine the characteristics of systems that can best exploit these properties. To this end a study was undertaken to more fully characterize the limitations of conventional interconnect, in particular in the context of source-terminated CMOS devices, a technology ... |
|
| Sharp-Looking Geometric Partitioning |
FEB 1991 |
6 pages |
| Authors:
S. Bapat; J. P. Cohoon; VIRGINIA UNIV CHARLOTTESVILLE CENTER FOR SEMICUSTOM INTEGRATED SYSTEMS
|
| A new technique, named SHARP, is presented for the partitioning of Very-Large-Scale Integration (VLSI) integrated circuits. SHARP is a hill-climbing heuristic that is designed to be incorporated into a partitioning-based placement algorithm. The method is more strongly influenced by the geometry of the layout surface than other partitioning methods, such as min-cut partitioning and the quadrisection approach. It is tuned for intra-package connections rather than inter-package connections. The method is ... |
|
| Proceedings of Technology Showcase Held in Huntsville, Alabama on 7-9 August 1990 |
09 AUG 90 |
|
| Authors:
ARMY MISSILE RESEARCH DEVELOPMENT AND ENGINEERING CENTER REDSTONE ARSENAL AL
|
| Six Directorates from the U.S. Army Missile Command Research Development and Engineering Center showcased research currently being carried out by the Command. Future needs and objectives are also addressed. |
|
| Proceedings of Technology Showcase held at Tom Bevil Center, Huntsville, AL on 7 and 9 August 1990. |
09 AUG 1990 |
|
| Authors:
ARMY MISSILE COMMAND REDSTONE ARSENAL AL RESEARCH AND ENGINEERING DIRECTORAT E (PROVISIONAL)
|
| Six Directorates from the U.S. Army Missile Command Research Development and Engineering Center showcased research currently being carried out by the Command. Future needs and objectives are also addressed. |
|
| Thermal Resistances of Joint Army Navy (JAN) Certified Microcircuit Packages |
AUG 86 |
84 pages |
| Authors:
Ralph M. Mindock; HIGH TECHNOLOGY SENSORS INC LONGWOOD FL
|
| The actual thermal resistance value of Joint Army Navy (JAN) certified microcircuit packages was determined. The thermal resistance from the junction to the case (theta sub jc) was used to characterize the JAN packages. A thermal chip with uniform heating was used for the thermal testing. The thermal chip eliminates much of the ambiguity of thermal testing and is the recommended method for thermal characterization of packages. Thermal resistance values ... |
|
| Materials Research Society Symposia Proceedings. Volume 40. Electronic Packaging Materials Science Held on November 27-29, 1984 at Boston, Massachusetts |
85 |
|
| Authors:
E. A. Giess; K. N. Tu; D. R. Uhlmann; MATERIALS RESEARCH SOCIETY UNIVERSITY PARK PA
|
| The principal aim of the Symposium was to convene scientists from the diverse disciplines related to the electronic packaging technology. The original Preliminary Announcement and Call for Papers set the theme and scope as follows: Improvements in electronic system include more complex packages to carry and interconnect semiconductor devices. As packages evolve from simple designs and parts into complicated multicomponent ones, the technology increasingly must draw support from multidisciplinary materials ... |
|
| The Effects of Water and Hydrogen on Materials Used in Integrated Circuit Packages |
DEC 84 |
|
| Authors:
M. W. Prairie; AIR FORCE INST OF TECH WRIGHT-PATTERSON AFB OH SCHOOL OF ENGINEERING
|
| This investigation determined the adsorption properties of water on RC-5878 polyimide, rolled gold foil, and rolled nickel foil at 20 C, as well as the effects that hydrogen has on nickel foil with a monolayer coverage of water molecules. Adsorption isotherms were obtained using a vacuum ultramicrobalance with a sensibility of 0.1 micrograms per 10 gram load. The microbalance system includes a gas handling system, a stainless steel housing, and ... |
|
| Hybrid Coupled Microstrip Amplifier. |
15 NOV 1983 |
|
| Authors:
D. Rubin; DEPARTMENT OF THE NAVY WASHINGTON DC
|
| A microstrip integrated circuit reflection amplifier utilizing packaged diodes and permitting some gain and bandwidth adjustment. A 3 db quadrature coupler has two of its ports connected to substantially identical reflection amplifiers. The reflection diodes are adjustably mounted in brackets perpendicular to the dielectric substrate of the microstrip network and may be moved in and out along the microstrip circuit to provide for some gain correction and bandwidth adjustment. (Author) ... |
|
| Nondestructive Inspection (NDI) of Glass-to-Metal Seals in Hybrid Packages. |
JAN 1983 |
|
| Authors:
Harold Goldfarb; Bernard L. Weigand; J. J. Licari; ROCKWELL INTERNATIONAL ANAHEIM CA AUTONETICS STRATEGIC SYSTEMS DIV
|
| The objective of this study was to investigate improved and simplified methods for nondestructive testing of unlidded microcircuit packages. A specific objective was to evaluate penetrant gases which would react chemically with organic compounds to produce colored dyes. Though several gas/dye systems were found to produce the desired colored changes, none was sensitive in detecting leak rates, even of the order of 1 x .000001 std cc/sec or less. |
|
| Control of GaAs Microwave Schottky Diode Electrical Characteristics by Contact Geometry: The Gap Diode |
MAY 1982 |
|
| Authors:
S. J. J. Teng; R. E. Goldwasser; F. J. Rosenbaum; UNIV OF WASHINGTON SEATTLE DEPT OF ELECTRICAL ENGINEERING
|
| This report presents a new low turn-on Schottky diode, whose I-V characteristics can be controlled by an ohmic gap between Schottky-barrier regions. A survey of barrier-height control techniques and the physics of Schottky-barrier and ohmic contacts is presented. Simple design theories for two types of gap-controlled diodes are discussed. GaAs VPE growth and diode microfabrication procedures are described and results are evaluated. The I-V characteristics, temperature sensitivity, and mixer conversion ... |
|
| A Microcircuit for Space Applications |
04 DEC 1981 |
|
| Authors:
S. R. Highley; NAVAL RESEARCH LAB WASHINGTON DC
|
| The need to reduce the volume of an electronic circuit package led to the development of a unique hybrid circuit package. Several problems were encountered during design, construction, and testing; and solved, producing a functional design with the final system package size about 1/5 that required for standard packaging. |
|
| Military Adaptation of Commercial Item (MACI) Program on Electrically Alterable Read Only Memory (EAROM). |
OCT 1980 |
|
| Authors:
Richard L. Wiker; R. W. Carter; J. Mattox; HONEYWELL INC ST PETERSBURG FL
|
| This report is a comparison of MNOS Device performance, device type selection, development of screening tests, and test plan. (Author) |
|
| 140 GHz Pulsed Impatt Combiner High Power Source. |
JAN 1980 |
|
| Authors:
T. T. Fong; T. A. Midford; E. M. Nakaji; Y. C. Ngan; HUGHES AIRCRAFT CO TORRANCE CALIF TORRANCE RESEARCH CENTER
|
| The objective of this program was to develop silicon IMPATT diode and power combiner circuit technology in order to demonstrate improved pulse power generating capability at 140 GHz. The program efforts have led to significant advances in the state-of-the-art for pulsed solid state power generation in D-band. The diodes fabricated for this program were double drift IMPATTs with active regions formed by a combination of n-type epitaxial growth and multiple ... |
|
| A Study of Communication Processor Systems. |
DEC 1979 |
196 pages |
| Authors:
Tse-yun Feng; Dharma P. Agrawal; WAYNE STATE UNIV DETROIT MICH
|
| A communication processor system (CPS) is expected to fulfill the requirements of both communication and computing functions. Hence, major characteristics pertaining to these two aspects are reviewed and their relative merits are carefully examined. At present, there are hundreds of CPS's now in operation or in planning. Among them, several of the important systems considered and the major emphasis is given to those systems which have recently been proposed by ... |
|
| Military Adaptation of Commercial Item (MACI) Program on Electrically Alterable Read Only Memory (EAROM). |
OCT 1979 |
|
| Authors:
Richard L. Wiker; HONEYWELL INC ST PETERSBURG FLA
|
| A military applications survey for EAROM devices was conducted. Three potential vendors of suitable EAROM devices were identified at GI, NCR and Nitron. Devices were procured and testing started. Measurement techniques were developed to characterize unique MNOS parameters. (Author) |
|
| Electrical Characterization of 16K Dynamic RAMs. |
FEB 1979 |
|
| Authors:
F. D. Austin; J. R. Florini; E. L. Hunter; F. A. Nezelek; IBM FEDERAL SYSTEMS DIV OWEGO N Y
|
| Electrical characterizations were performed on 16K dynamic RAMs available from the merchant semiconductor industry. Based on the data obtained, parameter limits were established and proposed for a draft 38510 specification. The data, proposed limits, and related discussion are presented. (Author) |
|
| Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices. Volume 2. Technical and Operational Parts 1 and 2. |
DEC 1978 |
|
| Authors:
A. W. Dozier; W. R. Smith; HUGHES AIRCRAFT CO FULLERTON CALIF GROUND SYSTEMS GROUP
|
| The object of the program was the establishment of a production capability for surface acoustic wave devices of varied design and material for the purpose of meeting estimated military needs for a period of two years after the completion of the contract, and to establish a base and plans which may be used to meet expanded requirements. The primary requirements was the pilot line production of devices that are reliable, ... |
|
| Removable Encapsulant for Protection of Electronic Equipment. |
10 OCT 1978 |
|
| Authors:
Rocco Richard Palmisano; DEPARTMENT OF THE ARMY WASHINGTON DC
|
| A method of providing an easily removable encapsulant for electronic circuit assemblies is disclosed. According to the method, a body of a suitable inexpensive, low density, foamed silicone rubber which is environmentally and electrically stable is divided into pellets or fine particles. The pellets or particles are poured into a circuit assembly housing to fill voids between the housing and the circuit assembly itself. Since the encapsulating material does not ... |
|
| Critique of the Centrifuge as a Stressing Device. |
MAY 1978 |
|
| Authors:
Charles Libove; SYRACUSE UNIV NY DEPT OF MECHANICAL AND AEROSPACE ENGINEERING
|
| The results of this study provide mathematical relationships to theoretically assess the capabilities of the centrifuge test as a stressing device for the following microelectronic components: wires and wire bonds, chip and substrate attachment, lids and bases of rectangular flat-packs. The results of the study suggest that the centrifuge is of marginal utility as a stressing device for the above mentioned components. (Author) |
|
| Standard Avionic Module Study. |
MAR 1978 |
|
| Authors:
D. B. McBrayer; G. R. Courtney; A. R. Tomme; VOUGHT CORP DALLAS TEX
|
| This report covers the Standard Avionic Module (SAM) study performed by Vought Corporation under Contract N00123-77-C-0094, Work Assignment 0008 for the Naval Weapons Center. The purpose of this study was to propose the characteristics of a standard module based upon the data and conclusions of previous Navy studies. The proposed module should satisfy the greatest majority of requirements enumerated in the final reports for those studies. The data base and ... |
|
| Spring Type Dogging Device. |
24 JAN 1978 |
|
| Authors:
James A. Rew; DEPARTMENT OF THE AIR FORCE WASHINGTON D C
|
| A clamping device for securing a workpiece such as an electronic package to a support such as a heat sink. A curved slot is machined around a central opening in the body of a configurated flat metal clamp having an extending lip which contacts the edge of the workpiece. The central opening in the clamp body receives a hold down screw member which threadably engages the support. When the hold ... |
|
| Electronic Equipment Enclosure. |
15 MAR 1977 |
|
| Authors:
Clyde L. Ward; DEPARTMENT OF THE NAVY WASHINGTON D C
|
| A low-cost package for electronic components is achieved by utilizing an integrally molded, lightweight plastic enclosure having a laminated construction with inner and outer shells fabricated of lightweight, high-impact resistant plastic having sandwiched therebetween a suitable filler material to provide stiffening and structural damping. Self-contained heat pipes may be imbedded in the shell walls to provide the necessary cooling. The inner shell is formed with the necessary drawer or chassis ... |
|
| Standard Electronic Modules Exploratory Development Module Packaging Studies by Naval Weapon Support Center, Crane and Naval Avionics Facility, Indianapolis. |
01 SEP 1976 |
|
| Authors:
B. Dale Tague; NAVAL AVIONICS FACILITY INDIANAPOLIS IND
|
| This report summarizes the SEM Exploratory Development module packaging studies accomplished by NAFI and NWSC, Crane during FY 1976. The primary outputs of these studies are the criteria and background data to be used in the definition of a SEM conceptual module, or family of modules, compatible with higher level electronic functions. (Author) |
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Reports by Keyword(s)
PACKAGED CIRCUITS
