| Assured Reference Technology Research (ARTHR) Project. Delivery Order 0004: Fiber-Optic RF Distribution (FORD) (PREPRINT) |
FEB 2007 |
34 pages |
| Authors:
Daniel McLaughlin; Jeffrey Wells; Timothy Wurthh; Daniel Dresher; NORTHROP GRUMMAN SPACE TECHNOLOGY DAYTON OH
|
 | The use of fiber optics is considered herein as a means to distribute Radio Frequency (RF) signals across Printed Circuit Boards (PCB). The use of fiber optics is studied with an emphasis on reducing inter-board Electromagnetic Interference (EMI). High performance RF circuits are especially sensitive to EMI and other Radio Frequency Interference (RFI), resulting in poor circuit to circuit isolation, spurious signals, additional filtering requirements, and increased shielding constraints. Fiber-optic ... |
|
| Study on PCB Properties of Epoxy Based Nanocomposites with Different Types of Layered Hybrid Materials |
26 JUL 2006 |
13 pages |
| Authors:
Yun D. Park; SEOUL NATIONAL UNIV (REPUBLIC OF KOREA) SCHOOL OF PHYSICS
|
| The contractor shall investigate: (1) An epoxy/clay nanocomposite matrix material for printed circuit boards, (2) A prepreg for printed circuit boards which contains the epoxy/clay nanocomposite matrix material, and (3) A printed circuit board made with at least one of proposed prepregs. |
|
| Vibration Testing of Repaired Lead-Tin/Lead-Free Solder Joints (Preprint) |
FEB 2006 |
9 pages |
| Authors:
Martin G. Perez; Matthew J. O'Keefe; Richard Colfax; Steve Vetter; Dale Murry; James Smith; David W. Kleine; Patricia Amick; MISSOURI UNIV-ROLLA MATERIALS RESEARCH CENTER
|
| Due to growing environmental concerns and recent legislation, tin-lead (Pb-Sn) solders are being phased out by lead-free (LF) solders. The most common Sn-Pb replacement is the tin-silver-copper (Sn-Ag-Cu, SAC) alloys. During the transition phase, it is expected that there will be a period where both Sn-Pb and LF solders will be used side by side, and in conjunction with one another, during assembly processes. Repaired solder joints may also be ... |
|
| Optimizing System Compute and Bandwidth Density for Deployed HPEC applications |
20 AUG 2004 |
20 pages |
| Authors:
Randy Banton; Richard Jaenicke; MERCURY COMPUTER SYSTEMS INC CHELMSFORDMA
|
| Many high-end deployed military and commercial applications share a common need to achieve high to very high compute and bandwidth density in the smallest possible volume. In addition, deployed military applications layer on additional environmental requirements, such as higher levels of shock, vibration, endurance vibration, temperature, and condensing humidity. Each of these requirements adds constraints on the solution space for maximizing compute and communication density. Not all HPEC applications can ... |
|
| DEEPER: Discovery and Exploitation of Emergent Physics through Evolutionary Refinement |
FEB 2004 |
13 pages |
| Authors:
Julian F. Miller; Simon Harding; YORK UNIV (UNITED KINGDOM)
|
| The DEEPER project aims to see if artificial evolution can create entirely new technologies, such as transistor-less circuits for sophisticated technological applications. The project is likely to have high impact in basic science. Using artificial evolution to explore "bottom-up" may lead to devices with significant advantages in size/weight ratio, fault tolerance, radiation tolerance, and speed of response. The project objectives are as follows: (1) to build and test an intrinsic ... |
|
| Inkjet Printing of Flexible Circuits on Polymer Substrate |
18 NOV 1999 |
27 pages |
| Authors:
Chung-tse Chu; MATERIALS RESEARCH INST BEAVERCREEK OH
|
| Flexible printed circuits have a wide range of applications in consumer electronics, computers, automobiles, and space and aerospace vehicles. In this Small Business Technology Transfer (STTR) Phase 1 program, Materials Research Institute (MRI) and University of Dayton Research Institute (UDRI) demonstrated the feasibility of a new processing scheme leading toward the fabrication of high performance, low cost flexible circuits with computer aided design tools ... |
|
| Wet-Spinning Fiber Process Providing Controlled Morphology of the Wet-Spun Fiber |
17 AUG 1999 |
|
| Authors:
Leonard J. Buckley; Mark Eashoo; DEPARTMENT OF THE NAVY WASHINGTON DC
|
 | A wet spinning fiber process which controls the microstructure of the wet spun fiber by varying the non-solvent/solvent miscibility and precipitation strength. |
|
| Nonintrusive System for Replication of interlayer Printed Circuit Patterns |
FEB 1998 |
45 pages |
| Authors:
M. Chai; A. Chau; QUEST INTEGRATED INC KENT WA
|
| Report developed under SBIR contract. The overall objective of this Phase I research program was to develop a nonintrusive method to image the art work of interlayer printed circuit board. Using forward Compton scattering and innovative design of a high-efficiency and high-resolution ring-slit Compton scattering camera, we have both theoretically demonstrated and experimentally verified the feasibility of reverse engineering the circuit board. An algorithm using 2-D projection and Compton scattering ... |
|
| A High-Temperature Printed Circuit Board |
NOV 96 |
19 pages |
| Authors:
Bruce R. Geil; Merle W. DeLancey; ARMY RESEARCH LAB ADELPHI MD
|
| Working with the U.S. Army Space and Strategic Defense Command, the Army Research Laboratory has developed an easy-to-produce, reliable, high- temperature printed circuit board for radiation studies of circuits that use silicon carbide transistors. This board is designed to operate at temperatures beyond 300 deg C. The board consists of an alumina substrate with thick-film gold traces. Stainless-steel pin receptacles are used to mount the transistors, allowing easy insertion and ... |
|
| High Thermal Conductivity Graphite Electronic Components |
AUG 96 |
23 pages |
| Authors:
S. O. Peck; G. L. Young; W. J. Mellberg; A. F. Wellman; J. E. Cooney; LORAL SPACE SYSTEMS PALO ALTO CA
|
| This project will apply high thermal conductivity graphite to three major spacecraft electronic components: (1) the thermal plane of a printed wiring board, (2) the subassembly or tray that holds the board, and (3) the equipment panel that the tray mounts on. The complete heat transfer path from chip level heat source to radiative rejection on the exterior surface of the equipment panel will therefore be addressed. Thermal and structural ... |
|
| Liquefied Metal Jet Program (LMJP). Environmental Impact Study |
15 DEC 95 |
8 pages |
| Authors:
John Priest; Nick Dringenburg; Charles Smith; Patrick DuBois; TEXAS INSTRUMENTS INC DALLAS DEFENSE SYSTEMS AND ELECTRONICS GROUP
|
| Department of Defense (DoD) agencies are major users of electronics and are responsible for much of the current printing wiring board (PWB) manufacturing. Current manufacturing of PWBs utilizes photolithography and chemical etchings which are subtractive processing techniques creating tons of hazardous waste materials and waste water each year. The current processing techniques apply photoresist to the surface of a copper clad board only to remove more than 90 percent of ... |
|
| The Reliability of Laser Reflowed Sn-Ag Solder Joints |
19 SEP 95 |
28 pages |
| Authors:
C. H. Raeder; D. L. Millard; R. W. Messler; RENSSELAER POLYTECHNIC INST TROY NY
|
| Measurement of thermal cycling stress-strain hysteresis for soldered joints is described by several authors. In the first study to report experimentally measured thermomechanical (T-M) stress-strain hysteresis, only a single ceramic leadless chip carrier soldered to a fiberglass reinforced polymer (FR4) printed wiring board and a single thermal cycle was used throughout the study. These conditions prescribe one value of k' and one value of gamma sub fc. Only stable loop ... |
|
| Life Cycle Costs of Alternatives for F-16 Printed Circuit Board Diagnosis Equipment |
DEC 94 |
53 pages |
| Authors:
Kent R. Montgomery; Clifford B. Thorstenson; AIR FORCE INST OF TECH WRIGHT-PATTERSON AFB OH SCHOOL OF LOGISTICS AND ACQUIS ITION MANAGEMENT
|
| This study analyzes two alternatives for printed circuit board (PCB) diagnosis for the F-16 depot PCB repair shop from a life cycle cost (LCC) perspective. Alternative 1 assumes the use of the current F-16 automatic test equipment (ATE) while Alternative 2 augments the current ATE with infrared imaging test equipment. Infrared imaging is a developed technology that is currently available to the Air Force in a commercial-off-the-shelf (COTS) form. Using ... |
|
| Gerber Format to CNC Punch Translator |
AUG 94 |
23 pages |
| Authors:
Kenneth J. Keyes; VITRONICS INC EATONTOWN NJ
|
| Application specific translators provide an efficient means of converting the output of an engineering software package to match the input of another engineering software package; thus, enabling an automated conversion between engineering software packages. In this report, one such application of a translator which provides a vehicle to program a CNC Punch Machine (an automated hole punching machine) from a Gerber Format File (a standard format for PCB artwork photoplotting) ... |
|
| EM Visualization of Printed Circuit Board Assemblies. A Phase 1 SBIR on behalf of USAF; SA-ALC/LDAE |
20 JUN 94 |
69 pages |
| Authors:
HEWITT AND ASSOCIATES INC ALBUQUERQUE NM
|
| Presently, the ability to rapidly collect reliable information about the detailed condition of a functionally suspect printed circuit board assembly (PCBA) is marginal. This data is necessary, to assure rapid and reliable PCBA repair, thereby maximizing uptime, minimizing spares stocks, etc. The need is real for both commercial and US government applications and becomes critical as electronic products become more complex (eg: one cannot treat expensive boards as expendable). Provide ... |
|
| Screening of Flexible Cables by Nonlinear Resistance Measurements |
10 JAN 94 |
29 pages |
| Authors:
G. W. Stupian; AEROSPACE CORP EL SEGUNDO CA TECHNOLOGY OPERATIONS
|
| Two traces in flexible cables used in the Milstar agile beam antenna system failed during acceptance testing. The cables, essentially printed circuit boards fabricated on flexible substrates, are composed of copper-foil conductors sandwiched between insulating Kapton layers. The cables carry current pulses used in the steering circuitry for the antenna beam. Upon sectioning and inspection of the suspect cables, substantial thinning of the copper foil conductors at feedthrough connections was ... |
|
| United States Air Force Summer Research Program -- 1993. Volume 14. Rome Laboratory |
DEC 93 |
|
| Authors:
RESEARCH AND DEVELOPMENT LABS CULVER CITY CA
|
|
| An Automatic Placement Tool for Rapid Prototyping of Printed Circuit Boards |
NOV 93 |
24 pages |
| Authors:
John Granacki; Tauseef Kazi; UNIVERSITY OF SOUTHERN CALIFORNIA MARINA DEL REY INFORMATION SCIENCES INST
|
| This report describes a fully automatic placement tool for PCBs (printed circuit boards), nap (nonhierarchical automatic placement) that combines approaches from different placement heuristics developed both for PCB and VLSI chip placement. Although the problem of placement for a PCB can be abstractly cast into the same formalism as the problem of VLSI cell placement, a practical tool must incorporate many additional features. In this report we describe the impact ... |
|
| Reliability Analysis of Surface Mount Technology (SMT) |
MAR 93 |
292 pages |
| Authors:
Chris A. Myers; Kalyan K. Chakrabarti; Donald H. Merlino; Edward G. Palmer; Edward F. Pello; HARRIS CORP MELBOURNE FL GOVERNMENT AEROSPACE SYSTEMS DIV
|
| This report indoctrinates the reader with the understanding of what is involved and necessary in designing and assessing the reliability of surface mount products . Deterministic methods were used to identify the primary design and environmental drivers and statistical methods were used to generate a SMT reliability assessment model. Due to the unavailability of field failure data, finite element analyses (FEA) and environmental test data were used to quantify the ... |
|
| Prototype and Short-Run Printed Circuit Board Creation |
MAR 93 |
23 pages |
| Authors:
Darryl Hoelder; ARMY MISSILE COMMAND REDSTONE ARSENAL AL WEAPONS SCIENCE DIRECTORATE
|
| This report describes the knowledge and experience developed within this directorate over the past several months in the fabrication of Printed Circuit Board (PCB) techniques. Due to the limited quantity of identical, custom-made PCB's needed for use in the laboratory, it is both cost-effective and less time-consuming to fabricate PCB's in-house, than to employ an outside supplier. The combination of equipment and techniques permits the fabrication of single and short-run ... |
|
| Optical High-Speed Parallel Backplane. |
28 JUL 1992 |
|
| Authors:
Albert J. Corda; DEPARTMENT OF THE NAVY WASHINGTON DC
|
| An optical backplane for use in a high-speed, parallel signal processing system. A plurality of circularly shaped optical conductors are arranged in a cylindrical topology. A plurality of printed circuit card connectors are disposed radially about the perimeter of the optical conductors. Each connector consists of a linear array of optical transceivers. The lens of each optical transceiver is mounted in a socket provided at the perimeter of each optical ... |
|
| High Speed Parallel Backplane. |
02 JUN 1992 |
|
| Authors:
Albert J. Corda; DEPARTMENT OF THE NAVY WASHINGTON DC
|
| A cylindrical high speed parallel backplane for electrically inter-connecting a plurality of printed circuit boards in a data processing system. A plurality of cylindrical plate conductor structures are arranged parallel to one another. A plurality of circuit board connectors are disposed radially about the perimeter. of the plate conductor structures to electrically connect the printed circuit board to the plate conductors structures. This cylindrical design of the backplane provides a ... |
|
| PCB Tester Selection for Future Systems. Volume 1 |
JUN 92 |
|
| Authors:
William Schmitt; MANTECH SUPPORT TECHNOLOGY INC ALEXANDRIA VA
|
| This report describes a computer program (to run on an IBM compatible PC) designed to aid in the selection of a PCB tester, given the characteristics of the PC board to be tested. The program contains a limited data base of PCB testers, and others may be added easily. This report also provides a specification for a limited family of PCB testers to fill the gap between what the U.S. ... |
|
| Development of an Expendable Particle Sensor |
06 MAY 92 |
|
| Authors:
SEA TECH INC CORVALLIS OR
|
|
| Development of an Expendable Particle Sensor |
06 MAY 92 |
|
| Authors:
Robert Bartz; SEA TECH INC CORVALLIS OR
|
| This report documents progress on the Phase II Development of the Expendable Particle Sensor (EPS). We determined the noise level of the telemetry system with the Printed Circuit Board (PCB) developed in November 1991. In addition, we had a PCB expansion card made which contained the electronics of receiver end of the telemetry system. |
|
| Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies |
APR 92 |
477 pages |
| Authors:
P. Crepeau; P. Glaser; J. Murray; G. Swiech; TRW MILITARY ELECTRONICS AND AVIONICS DIV SAN DIEGO CA
|
| This Task 3 Technical Operating Report is comprised of three basic sections. The first section is an overall description of the Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies (PWAs) Program. Included is a description of the PWA design, continuous process improvement, and the seven basic experimental approach. The second section presents the results obtained by performing the statistically designed experiments described in the second technical report for this ... |
|
| Computed Tomography of Electronics |
DEC 89 |
|
| Authors:
Richard H. Bossi; Robert J. Kruse; Benjamin W. Knutson; BOEING AEROSPACE CO SEATTLE WA
|
| The application of Computed Tomography (CT) and laminography has been tested on a variety of electronic components. The effort was performed as a preliminary testing task assignment in the Advanced Development of X-ray Computed Tomography Application program. A key area for testing was printed circuit boards for the inspection of solder bonds and in particular for leadless chip carrier devices. During the course of the task assignment several other categories ... |
|
| Proceedings of the Electronics Manufacturing Seminar (13th Annual) Held at China Lake, California on 1-3 March 1989 |
MAR 89 |
|
| Authors:
NAVAL WEAPONS CENTER CHINA LAKE CA
|
| Presented are the proceedings of the 13th Annual Electronics Manufacturing Seminar, held on 1-3 March 1989 at the Naval Weapons Center, China Lake, Calif. |
|
| Claw Grip Contact Probe for Flat Packs. |
30 AUG 1988 |
|
| Authors:
Joseph W. Shearer Jr.; Sylvio T. Phaneuf; DEPARTMENT OF THE AIR FORCE WASHINGTON DC
|
| Described is a probe device including a unitary body and a sliding plate means for testing and diagnosing multi-lead electrical flat packs. The sliding plate means contains two sets of holes into which are inserted spring-loaded electrical contact probes for making contact with the leads of the electrical flat pack. The unitary body includes comb teeth for orienting the unitary body over the leads of the electrical flat pack, as ... |
|
| The Many Methods to Measure Testability: A Horror Story |
APR 88 |
|
| Authors:
Jim C. Bussert; NAVAL OCEAN SYSTEMS CENTER SAN DIEGO CA
|
| The author has personally modeled designs varying from a Small Scale Integration (SSI) printed circuit board (PCB) up to a modern tank Fire Control System (FCS) of over 20 boxes using over a dozen Testability Figure of Merit (TFOM) tools. These various algorithms used a total of 70 different outputs that were intended to measure the TFOM inherent for a particular design. This paper will first review and categorize all ... |
|
| Printed Circuit Board Clamp Fixture. |
15 MAR 1988 |
|
| Authors:
Marc P. Hirschhorn; James H. Magown; DEPARTMENT OF THE NAVY WASHINGTON DC
|
| First and second mirror image identical clamps clamp opposite edges of a printed circuit board along the length of those edges for holding the board during wave soldering of components to the board. Each clamp includes a support rail and a clamp rail wherein the support rail has a shoulder on which a portion of the clamp rail can abut. The clamp rail has a two walled groove which receives ... |
|
| Proceedings of the Annual Electronics Manufacturing Seminar (12th) Held in China Lake, California on 17-19 February 1988 |
FEB 88 |
|
| Authors:
NAVAL WEAPONS CENTER CHINA LAKE CA
|
| Presented are the proceedings of the 12th Annual Electronics Manufacturing Seminar, held on 17-19 February 1988 at the Naval Weapons Center, China Lake, CA. |
|
| The Inspection of Electronic Metallurgical Bonds |
FEB 88 |
|
| Authors:
Bart Jackson; Jerel Smith; James Stanley; ADVANCED RESEARCH AND APPLICATIONS CORP SUNNYVALE CA
|
| The solder bonds in electronic assemblies are an area of increased Non-Destructive Evaluation interest as the number of bonds per assembly increases, the size of the bonds decreases, and the dependence on the bonds for electrical and mechanical performance increases. The current inspection techniques are not detecting many defects, and the inspection techniques are not adequate for the near-term Surface Mount Technology improvements. Computed Tomography is a new NDE technology ... |
|
| Procedures for Identification and Handling of Printed Circuit Boards (PCBs) |
DEC 87 |
|
| Authors:
ARMY MATERIEL COMMAND TOBYHANNA PA PACKAGING STORAGE AND CONTAINERIZATION CEN TER
|
| Presently, the Army is faced with two major problems concerning handling and identifying printed circuit boards (PCBs): 1. Many PCBs are damaged within the repair and supply cycle from electrostatic discharge (ESD) or electromagnetic induction (EMI). 2. PCBs are lost because supply personnel are unable to identify them, this damage or loss costs us, the taxpayer, a lot of money. It is estimated that the average cost of a PCB ... |
|
| Portable, Electronically Controlled, Integrated, P.C.B. (Printed Circuit Board) Rework Station. |
24 NOV 1987 |
|
| Authors:
Gerald D. Opfer; DEPARTMENT OF THE NAVY WASHINGTON DC
|
| A portable work center is a self-contained, electronic, electro-mechanical, bench top work unit used in the servicing of electronic circuits and specifically printed circuit boards. Solder iron temperature adjust control functions, a continuously variable vacuum or pressure control function, a mechanical rotary drive power control function, low voltage hand tool power supply function, and alternate foot switch control unit, a digital display input for control and function selection, digital displays ... |
|
| Industrial Technology Modernization. Phase 2. Project 8, PWB (Printed Wire Board) Inspection. Revision A |
09 OCT 87 |
|
| Authors:
GENERAL DYNAMICS FORT WORTH TX FORT WORTH DIV
|
| This process will automatically inspect flimsies, panels, and completed boards measuring line spacing, widths, and flaws. The cell will incorporate robotic technologies. Nineteen cameras will digitize the inspection boards dimensions for comparison with a dimension and measurement database. |
|
| VAXELN Experimentation: Programming a Real-Time Clock and Interrupt Handling Using VAXELN Ada 1.1 |
OCT 87 |
|
| Authors:
Mark W. Borger; CARNEGIE-MELLON UNIV PITTSBURGH PA SOFTWARE ENGINEERING INST
|
| This report describes the results of implementing an interrupt handler totally in Ada for a MicroVax II/VAXELN 2.3 target system, the VAXELN 1. 1 Ada compiler, and a KWV11-C programmable real-time clock. It provides an overview of VAXELN interrupt handlers and the operation of the real-time clock; discusses and demonstrates the use of VAXELN kernel services to establish a link between the clock's interrupt and the starting address an interrupt ... |
|
| Low Cycle Fatigue of Surface Mounted Chip Carrier/Printed Wiring Board Joints |
SEP 87 |
|
| Authors:
H. D. Solomon; MARTIN MARIETTA CORP ORLANDO FL
|
| Chip carrier/printer wiring board joints have been tested isothermally, at 35 C, in shear. The joints were subjected to fully reversed cycling with fixed plastic displacement limits. The fatigue life was correlated to this displacement by a pseudo Coffin-Manson law. The fatigue life was defined in terms of a 25%,50%,90%, and 100% drop in the load required to produce a given displacement. The resistance of each of 22 joints was ... |
|
| Industrial Technology Modernization Program. Category 2 Project. Printed Wiring Board (PWB) Process Fixture |
31 AUG 87 |
|
| Authors:
Russ Petrie; GENERAL DYNAMICS FORT WORTH TX FORT WORTH DIV
|
| The problems under consideration center around the interpretation of binocular stereo disparity. In particular, the goal is the establish a set of mappings from stereo disparity to corresponding three dimensional scene sgeometry. Stereo disparity is represented as a vector field derived from differential projection of a three dimensional scene onto a pair of two- dimensional imaging surfaces. The resulting disparity field is analyzed with the aid of mathematical tools from ... |
|
| Single-Layer Wire Routing |
AUG 87 |
|
| Authors:
F. M. Maley; MASSACHUSETTS INST OF TECH CAMBRIDGE LAB FOR COMPUTER SCIENCE
|
| This dissertation concerns the problem of routing wires on a single layer of an integrated circuit or printed circuit board, starting from a sketch of the layer. A sketch specifies the positions of layout features and the topology of the interconnecting wires. Efficient algorithms are presented that (1) determine whether a sketch is routable, and (2) produce for a routable sketch a proper routing that minimizes both individual and total ... |
|
| Board Level Development of the AFIT (Air Force Institute of Technology) VME Design Board |
MAY 87 |
|
| Authors:
Mohammad S. Javed; AIR FORCE INST OF TECH WRIGHT-PATTERSON AFB OH SCHOOL OF ENGINEERING
|
| As a part of this research, a content addressable memory(CAM) controller chip has been recently designed to control the operation of the CAM chips. There is also the need to design, implement, and fabricate a general purpose Printed Circuit Board (PCB) to implement specific application circuitry at a system level. For the Content Addressable Memory system this consists of the CAM chips, the CAM controller, and interface circuitry to test ... |
|
| Industrial Technology Modernization Program. Appendix 1. User Software Documentation. Appendix 2. Program Documentation, Category 2 Project. Computer Aided Processing System (CAPS) |
20 MAR 87 |
|
| Authors:
TRACOR AEROSPACE AUSTIN INC TX
|
| The purpose of this document is to provide the user with the knowledge and information necessary to use the CAPS instruction sheet generation module knowledge. The Instruction Sheet generation module of the Computer Aided Processing System (CAPS) is a tool to aid the Manufacturing Engineer in writing/ modifying Instruction Sheets in the Printed Wiring Board Assembly (PWA) area. It was designed to be as flexible as possible while minimizing the ... |
|
| Inspection Workstation Data Entry Method. |
03 FEB 1987 |
|
| Authors:
David Strong; DEPARTMENT OF THE AIR FORCE WASHINGTON DC
|
| An inspection workstation data entry method is used by electronic assembly inspector to substantially increase throughput and eliminate data entry errors. The method utilizes a sonic digitizer cursor and x-y linear microphones to record unique registration data and defect data. The inspector, without manual intervention for data entry, positions the assembly in a workarea, records a registration hole location and defect locations along with identifying information or processing requirements. The ... |
|
| Electronics Manufacturing Seminar Proceedings (11th Annual) Held in China Lake, California on 18-20 February 1987 |
FEB 87 |
|
| Authors:
NAVAL WEAPONS CENTER CHINA LAKE CA
|
| Presented are the proceedings of the 11th Annual Electronics Manufacturing Seminar, held on 18-20 February 1987 at the Naval Weapons Center, China Lake, CA. The proceedings include the papers presented at the Seminar and cover all aspects of soldering technology and electronics manufacturing. |
|
| Development of a Semi-Automated Machine for Repair of Surface Mounted Printed Circuits, |
FEB 1987 |
|
| Authors:
Donald J. Spigarelli; William F. Drislane; SRTECHNOLOLGIES INC CONCORD MA
|
| The major problem areas in removal and replace of surface mount devices, especially those with fine pitch and high lead counts, and the capabilities required to solve those problems are discussed. The major problem areas are solder reflow of surface mount devices (SMDs) without damage to the device itself or adjacent devices and solder joints, accurate pick and place, controllability of the important parameters in the repair process, and flexibility ... |
|
| SMD Soldering Technology Development at Government Systems Operations, Control Data Corporation, |
FEB 1987 |
|
| Authors:
Deepak K. Pai; CONTROL DATA CORP MINNEAPOLIS MN GOVERNMENT SYSTEMS MFG DIV
|
| A general discussion dealing with the design for manufacturability and manufacturing of surface mount assemblies will be addressed, including the development of the soldering of surface mount leadless, and fine-pitch, high-lead-count, gull wing chip carriers. Product design and manufacturing processes are predominantly driven to meet the requirements for advanced military computers. SMD soldering technology developed with the Navy's sponsored program, CIRCUIT CARD ASSEMBLY AND PROCESSING SYSTEM (CCAPS), methodology. |
|
| Susceptibility of PCB - Mounted Microelectronic Devices to Failures Caused by Electrostatic Discharges |
JAN 87 |
|
| Authors:
Perambur S. Neelakantaswamy; Abrahim R. Turkman; RIT RESEARCH CORP ROCHESTER NY
|
| Susceptibility of PCB-mounted devices to failures caused by electrostatic discharges (ESD) is studied. Theoretical analysis and a simulated experiment indicate higher vulnerability of subassembled (PCB-mounted) devices relative to their unmounted (isolated) counterparts. Keywords include: Electrostatic Discharge (ESD), Printed Circuit Boards (PCB), and Microelectronic Device Failure. |
|
| Holographic Detection of Latent Defects |
OCT 86 |
|
| Authors:
K. A. Arunkumar; J. D. Trolinger; SPECTRON DEVELOPMENT LABS INC COSTA MESA CA
|
| This project was aimed at seeing whether holographic interferometry (H.I.) could be used in evaluation standard environmental stress screening methods currently used to select and qualify printed circuit boards (PCB). To do that it should be proven that H.I. is capable of detecting defects in a PC board that have been brought about by the stress screening procedures. Hence, the objectives of this project were to determine: a) if holographic ... |
|
| Automated Testing and Fault Isolation of a Low Frequency Analog Circuit Card Assembly |
17 SEP 86 |
|
| Authors:
Michael D. Pilkenton; LOUISVILLE UNIV KY
|
| This thesis describes the automated testing and fault isolation which is performed on a Circuit Card Assembly (CCA) used in a complex naval weapons system. The automated testing is performed using a Hewlett Packard 9826 computer and IEEE-488 bus compatible equipment which comprise the Test Set known as the TE304. A complete circuit analysis of the CCA being tested is included in this thesis as well as program descriptions of ... |
|
| Evaluation of Multilayer Printed Wiring Boards by Metallographic Techniques. An Illustrated Guide to the Preparation and Inspection of Plated- Through Hole Test Coupons Based on the Requirements of MIL-P-55llOD |
MAY 86 |
73 pages |
| Authors:
Jane Jellison; NATIONAL AERONAUTICS AND SPACE ADMINISTRATION GREENBELT MD GODDARD SPACE FLIG HT CENTER
|
| This work is an illustrated handbook containing the rationale and procedure for the evaluation of multilayer printed wiring board construction integrity with respect to plated-through holes in accordance with the requirements of MIL-P-55l lOD, "Printed Wiring Boards." Itis intended as a practical aid for those concerned with determining the construction integrity of multilayer boards for high reliability applications. Photomicrographs of cross- sectioned holes illustrate defect types, acceptable and unacceptable conditions, ... |
|
Reports by Keyword(s)
*Printed circuit boards
