| Adhesion Measurements of Thin Films in Corrosive Environments |
SEP 2006 |
16 pages |
| Authors:
Alex A. Volinsky; Patrick Waters; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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 | With the use of thin films reaching a wide variety of applications, it is important to know how thin films will hold up in a variety of environmental conditions. Here, water effects on thin film adhesion were studied on copper and diamond like carbon (DLC) films. Regardless of the film being considered, it is usually advantageous to have a thin film that adheres well to its substrate. Because of the ... |
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| Mechanical Aspects of Anti-Corrosive Coatings Performance Tests |
SEP 2006 |
7 pages |
| Authors:
Alex A. Volinsky; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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| Protective coating corrosion failure is a complicated process that involves various phenomena which are hard to test for separately. An adequately protected pipe can be in service for a relatively long time without exhibiting any signs of corrosion failure, and then all of a sudden it corrodes over a short period of time. Failure will definitely happen if the interface between the pipe surface and its protective coating system is ... |
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| Novel Adhesion Test for Environmentally Assisted Fracture in Thin Films |
SEP 2006 |
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| Authors:
Alex A. Volinsky; Patrick Waters; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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 | Thin films, used in various applications and devices, must strongly adhere to their substrates. Due to various processing and storage environments that devices can be exposed to, water may be introduced into the system. If residual stresses are present in a thin film, delamination propagation can be driven by water without the assistance of an externally applied mechanical force. It is extremely important to measure coating adhesion quantitatively, taking into ... |
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| Stress and Moisture Effects on Thin Film Buckling Delamination |
25 JUL 2006 |
8 pages |
| Authors:
P. Waters; A. A. Volinsky; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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| Deposition processes control the properties of thin films; they can also introduce high residual stresses. which can be relieved by delamination and fracture. Tungsten films with high 1-2 GPa compressive residual stresses were sputter deposited on top of thin (below 100 nm) copper and diamond-like carbon (DLC) films. Highly stressed films store large amounts of strain energy. When the strain energy release rate exceeds the films interfacial toughness, delamination occurs. ... |
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| Moisture Effects on Copper Thin Film Adhesion |
NOV 2005 |
5 pages |
| Authors:
Patrick J. Waters; Alex A. Volinsky; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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| The effects of moisture on copper thin film adhesion have been investigated using a modified version of the superlayer indentation test. Copper films up to 100 nm thick were sputter deposited on thermally oxidized silicon wafers. A 1 um tungsten superlayer with I GPa compressive residual stress was sputter deposited on top of Cu films, providing extra energy for interfacial debonding upon indentation. The samples were first indented to a ... |
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| Sub-Critical Telephone Cord Delamination Propagation and Adhesion Measurements |
2005 |
6 pages |
| Authors:
Alex A. Volinsky; Patrick Waters; James D. Kiely; Earl C. Johns; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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| Thin film delamination can occur when the stored elastic energy per unit area in the film due to the residual stress exceeds the interfacial toughness. Telephone cord morphology is commonly observed in delaminating thin films under compressive stresses. Here, the biaxial film stress is partially relieved by film buckling in the direction perpendicular to the telephone cord propagation, and by "secondary" blister buckling in the direction of telephone cord propagation, ... |
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| Micro-Fluidic Applications of Telephone Cord Delamination Blisters |
2005 |
6 pages |
| Authors:
Alex A. Volinsky; Patrick Waters; Gregory Wright; UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING
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| Argon pressure significantly affects the residual stress in sputter deposited thin films and coatings. In case of W thin films, high residual stresses on the order of 1-2 GPa are quite common. With the rest of sputtering parameters being equal, argon pressure determines the sign and the value of residual stress. When the amount of stored elastic energy in the film due to the residual stress exceeds the interfacial toughness, ... |
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