The steady shrinking of integrated circuits demands constant innovation. Though ever-greater resolution remains the foremost goal, many new abilities are also needed - the reduction of toxic by-products (green chemistry), integration of heterogeneous materials (e.g., organic and inorganic) into a single structure, and the production of just a few integrated circuits at low cost. We are developing a new lithographic approach, thermal Dip Pen Nano-lithography (tDPN), to both achieve greater ...
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