This project has achieved many accomplishments toward "Massively Parallel Post-Packaging for MEMS." These achievements can be summarized as follows: (1) innovative bonding processes; (2) post-fabrication packaging demonstrations and characterizations on various MEMS devices; and (3) demonstrations and characterizations of post-fabrication device trimming. In summary, we were able to develop several new localized bonding processes, including eutectic bonding, fusion bonding, solder bonding, chemical vapor deposition (CVD) bonding, nano-second laser welding, inductive ...
In recognition of the major impact which microcomputers may have on society in general, and aviation in particular, the Federal Aviation Administration, Office of Aviation Policy, Policy Development Division, System Concepts Branch, has funded this study consistent with the goals of its Technology Assessment and Forecasting Program. The study has as its main objective the assessment of the impact of microcomputers on the National Aviation System (NAS). The time horizon ...
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