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Reports by Author

Samuel S. Russell


Click on the titles below to find US government-authored or -collected reports written by Samuel S. Russell

Total Results: 6 Results per page:
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Monitoring the Integrity of filament Wound Structures Using Built-In Sensor Networks 2005 9 pages
Authors:  Mark Lin; Amrita Kumar; Xinlin Qing; Shawn J. Beard; Samuel S. Russell; James L. Walker; Thomas K. Delay; ACELLENT TECHNOLOGIES INC SUNNYVALE CA
The full text of this report is available for sale.Monitoring the integrity of filament wound composite structures such as solid rocket motors and liquid fuel bottles is important in order to prevent catastrophic failures and to prolong the service life of these structures. To ensure the safety and reliability of rocket components, they require frequent inspection for structural damages that might have occurred during manufacturing, transportation, and storage. The timely and accurate detection, characterization and monitoring of structural cracking, ...


Neural Network/Acoustic Emission Burst Pressure Prediction For Impact Damaged Composite Pressure Vessels, AUG 1997
Authors:  James L. Walker; Samuel S. Russell; Gary L. Workman; Eric V. K. Hill
The full text of this report is not available and therefore is not for sale. This information is provided for reference purposes only.Acoustic emission signal analysis has been used to measure the effect impact damage has on the burst pressure of 146 mm (5.75 in.) diameter graphite/epoxy and the organic polymer, Kevlar/epoxy filament wound pressure vessels. Burst pressure prediction models were developed by correlating the differential acoustic emission amplitude distribution collected during low level hydroproof tests to known burst pressures using backpropagation artificial neural networks. Impact damage conditions ranging from barely visible ...


Building Better Flaws for Thermographic Qualification and Quantification, 1996
Authors:  James L. Walker; Samuel S. Russell; Gary L. Workman
The full text of this report is not available and therefore is not for sale. This information is provided for reference purposes only.The concurrent inspection of calibrated test panels manufactured with artificially created, although realistically behaving flaws is essential to providing confidence in the thermographic inspection process of advanced composite structures. For honeycomb type composite structures of principle interest is identifying delamination and disbond type defects along the bondline between the core and faceplate, as well as within the faceplate itself. To ensure that these types of flaws will be caught during ...


Thermal Test Chamber Device. 27 OCT 1988
Authors:  Daron C. Holderfield; Bernard E. Martin; Samuel S. Russell; DEPARTMENT OF THE ARMY WASHINGTON DC
The full text of this report is not available and therefore is not for sale. This information is provided for reference purposes only.A thermal test chamber device is provided that includes two half housing sections that are secured together to define a chamber there between with a window for viewing inside the chamber and with inlet and outlet means for supplying and exhausting a medium to and from the chamber. The lower half housing section has electrical circuit means mounted relative thereto for testing a semiconductor chip specimen when presented relative thereto. ...


Specimen Holder and Rotary Assembly. 27 OCT 1988
Authors:  Daron C. Holderfield; Bernard E. Martin; Samuel S. Russell; DEPARTMENT OF THE ARMY WASHINGTON DC
The full text of this report is not available and therefore is not for sale. This information is provided for reference purposes only.This patent application discloses a specimen holder and rotary mount in which a semiconductor chip can be accurately mounted and presented to a test device for checking the circuitry of the semiconductor chip as well as subjecting the chip to various thermal conditions. (edc)


Manual Microcircuit Die Test System. 27 OCT 1988
Authors:  Daron C. Holderfield; Bernard E. Martin; Samuel S. Russell; DEPARTMENT OF THE ARMY WASHINGTON DC
The full text of this report is not available and therefore is not for sale. This information is provided for reference purposes only.A system for testing semiconductor microchips is provided in which individual microchips can be tested electrically and under specific thermal conditions simultaneously to determine the reliability of the microchip under operating conditions. This system is unique and economically operable so as to enable all individual chips to be tested prior to mounting in larger assemblies. Patent applications. (RH)


Total Results: 6 Results per page: