With the increasing use of thin film devices, a need has arisen for a better understanding of the mechanical properties of these film/substrate systems. Of particular importance, in many cases, is the adhesion between substrate and film. Several methods are commonly used to test the mechanical behavior of these interfacial systems, but for the most part, they are not quantitative, lack repeatibility, and result in destruction of the sample. In ...
The mechanical behavior of the adhesive/adherent interface is extremely important as regards the performance of the overall structure of which it is a part. It is one of a class of problems requiring micro-mechanical characterization. Such characterization of the interface, or interphase region, is a particularly challenging task because of the size of the region and the fact that the critical area is generally near an edge. Acoustic microscopy at ...
Reports by Author
