A closed-loop spray cooling test setup is established for the cooling of high-power diode lasers. Eight miniature nozzles in a multinozzle plate are used to generated a spray array targeting at a 1 by 2 cm2 cooling surface. FC- 87, FC-72, methanol and water are used as the working fluids. Thermal performance data for the multinozzle spray cooling in the confined and closed system are obtained at various operating temperatures, ...
A fin array cooler was developed to cool a substrate of high-heat flux electronics. Plain copper fin strips were soldered onto the substrate to minimize the contact thermal resistance between the electronics and heat sink. Two new types of fin arrays based on offset fin strips and aligned fin strips were employed in order to mitigate the thermal stress problem found in the integral finned substrate concept. The cooler with ...
High performance miniature heat pipes are developed for the cooling of high heat flux electronics using new capillary structures which rely on the use of a folded copper sheet fin and a folded copper screen. Using the folded sheet fin, capillary fins with fully opened grooves and folded sheet fins with notches at the fin top are made through a brazing process and the electric- discharge-machining technique. The use of ...
Reports by Author
