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K II


Click on the titles below to find US government-authored or -collected reports written by K II

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Electro-Chemical-Mechanical, Low Stress, Automatic Polishing (ECMP) Device (Preprint) Jan 2010 15 pages
Authors:  J Tiley; C A Crouse; Shiveley; K II; G B Viswanathan; A Shiveley; AIR FORCE RESEARCH LAB WRIGHT-PATTERSON AFB OH METALS BRANCH
The full text of this report is available for sale.This document describes a low stress automated polishing device that was developed to prepare titanium and nickel alloy samples for imaging with electron microscopy. The system uses pulsed electrochemical reactions within an alkaline electrolyte to generate a thin passivation layer on the surface of the sample, which is removed by the mechanical vibration of the system. This research documents the passivation layer development and removal for Ti-6Al-4V and nickel 718 ...


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