| Wafer Level Micropackaging for RF MEMS Switches |
MAR 2005 |
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| Authors:
David I. Forehand; Charles L. Goldsmith; MEMTRONICS PLANO TX
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 | Wafer-level micro-encapsulation is an innovative, low-cost, wafer- level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages. |
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| A Model for Dielectric-Charging Effects in RF MEMS Capacitive Switches |
MAR 2005 |
10 pages |
| Authors:
Xiaobin Yuan; James C. Hwang; David Forehand; Charles L. Goldsmith; LEHIGH UNIV BETHLEHEM PA
|
 | For the first time, charging and discharging of traps in the dielectric of state-of-the-art RF MEMS capacitive switches were characterized in detail. Densities and time constants of different trap species were extracted under different control voltages. It was found that, while charging and discharging time constants are relatively independent of control voltage, steady-state charge densities increase exponentially with control voltage. A charge model was constructed to predict the amount of ... |
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| Wafer Level Micro-Encapsulation |
JAN 2005 |
7 pages |
| Authors:
David I. Forehand; Charles L. Goldsmith; MEMTRONICS PLANO TX
|
| Wafer-level micro-encapsulation is an innovative, low-cost, wafer- level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated < 0.1 dB package insertion loss up through 110 GHz and accounts for only 28% of the total packaged RF MEMS circuit cost. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages. |
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| Temperature Variation of Actuation Voltage in Capacitive MEMS Switches |
JAN 2005 |
6 pages |
| Authors:
Charles L. Goldsmith; David I. Forehand; MEMTRONICS PLANO TX
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| A simple theoretical model for temperature variation of actuation voltage for fixed-fixed beam switches is developed and applied to model capacitive RF MEMS switches. Measured data from these switches fits very well with the model over a 120 degrees C operating temperature range, while demonstrating a 3x reduction in variation compared to previous publications. The proposed model provides valuable insight into the factors impacting variability of actuation voltage over broad ... |
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| Robust, Reliable, Radio Frequency (RF) Microelectromechanical Systems (MEMS) Capacitive Switches |
JAN 2005 |
16 pages |
| Authors:
Charles L. Goldsmith; MEMTRONICS PLANO TX
|
| Wafer-level micro-encapsulation is an innovative, low-cost, wafer- level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated < 0.1 dB package insertion loss up through 110 GHz and accounts for only 28 % of the total packaged RF MEMS circuit cost. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages. |
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| Modeling and Characterization of Dielectric-Charging Effects in RF MEMS Capacitive Switches |
DEC 2004 |
7 pages |
| Authors:
Xiaobin Yuan; James C. Hwang; David Forehand; Charles L. Goldsmith; MEMTRONICS PLANO TX
|
| For the first time, charging and discharging of traps in the dielectric of state-of-the art RF MEMS capacitive switches were characterized in detail. Densities and time constants of different trap species were extracted under different control voltages. It was found that, while charging and discharging time constants are relatively independent of control voltage, steady-state charge densities increase exponentially with control voltage. A simple charge model was constructed to predict the ... |
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