| Friction & Wear Under Very High Electromagnetic Stress |
OCT 2004 |
18 pages |
| Authors:
Richard S. Cowan; Steven Danyluk; Francis Moon; J. C. Ford; Donald W. Brenner; GEORGIA INST OF TECH ATLANTA
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 | This document summarizes initial progress toward advancing the fundamental understanding of the friction, wear and mechanics of interfaces subjected to extreme electromagnetic stress, high relative velocities and elevated temperatures. During this reporting period, faculty and staff from Georgia Tech, Cornell, N.C. State and Rensselaer Polytechnic performed tasks in two thrust areas of basic research: Modeling and Experiment. With respect to the former, investigators are looking at mixed lubrication and its ... |
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| Influence of Tribochemical Reaction Products on Friction and Wear of Silicon Nitride at Elevated Temperatures in Reactive Environments |
92 |
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| Authors:
Dong Soo Park; Steven Danyluk; Michael J. McNallan; ILLINOIS UNIV AT CHICAGO CIRCLE DEPT OF CIVIL ENGINEERING MECHANICS AND METALL URGY
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 | Friction coefficients and wear rates of hot-pressed Si3N4 have been measured in a ball-on-flat linear-sliding geometry at temperatures ranging from room temperature to 1273 K in Ar and air containing up to 63% H2O. In inert environments, the friction coefficients (ranging between 0.6 and 0.7) are independent of temperature, and wear rates increase with temperature. In oxidizing environments, the friction and wear are reduced by the presence of tribochemical reaction ... |
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| interferometric measurement of residual stress |
FEB 90 |
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| Authors:
Steven Danyluk; a. t. andonian
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| the authors combine the theory of elasticity and a laser interferometric technique for the measurement of residual stresses in solids usually in thin, nominally flat plates. the technique described is nondestructive and measures the stress averaged through the thickness underlying each point of interest on the surface. (ntiac) |
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| RESIDUAL STRESSES OF THIN, SHORT RECTANGULAR PLATES |
DEC 85 |
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| Authors:
Arsavir T. Andonian; Steven Danyluk
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| the analysis of the residual stresses in thin, short rectangular plates is presented. the analysis is used in conjunction with a shadow moire interferometry technique by which residual stresses are obtained over a large spatial area from a strain measurement. the technique and analysis are applied to a residual stress measurement of polycrystalline silicon sheet grown by the edge-defined film growth technique. (author) |
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