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Abstract:
The purpose of this letter is to review and analyse the microbond test method (4,5) using finite-element analysis (FEA) and to propose ideas and suggestions for refining this test technology. Also, an attempt is made to determine the properties of the interface to be used in the design of composites.(author)
| Pages: |
3 |
| Report Date: |
91 |
| Report Number: |
D935202 |
Report Unavailable |
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