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 Electronics and Fluidics Electrical and Electronic Equipment |
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Modular Avionics Packaging (MAP).
Authors: GENERAL ELECTRIC CO UTICA N Y AIRCRAFT EQUIPMENT DIV |
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Abstract: In considering Modular Avionics Packaging, the objective of the General Electric study program was to develop an avionics equipment packaging concept, compatible with MIL-E-5400, and applicable to multiplatform avionics requirements stretching into the 1990's. Specific elements evaluated were: Standard Avionics Module (SAM) requirements and concepts; integrated racks and WRA requirements and concepts; and airframe interface considerations. The V/STOL Type A platform was used as the driving requirement in performing trade-off studies. Key design objectives and constraints included the following: Minimizing installed avionics weight and volume; Mechanical simplicity; Significant improvement in Reliability and Maintainability; Eliminating single-point failure modes; Direct access to Weapons Replaceable Modules (WRM); Modules capable of being conduction-cooled; Significant improvement in thermal performance; and Improved testability at all hardware levels.
| Description: |
Final rept. |
| Pages: |
341 |
| Report Date: |
30 NOV 1977 |
| Contract Number: |
N0016377C0295 |
| Report Number: |
A736950 |
Report Unavailable |
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