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Electronics and FluidicsElectrical and Electronic Equipment

Optical Input/Output (I/O) 'Pin' and 'Pin' Grid Arrays for Multichip Module (MCM) Inter-Layer and External Connectivity

Authors: Freddie Lin; PHYSICAL OPTICS CORP TORRANCE CA APPLIED TECHNOLOGY DIV
Abstract:
The increased complexity of electronic circuits and reduced component sizes has resulted in large numbers of Input/Output (I/O) interconnections for each module layer. However, the number of electrical interconnects that can be placed at module layer edges is limited. In addition, electrical interconnects are sensitive to external electromagnetic interference and interchannel electrical cross talk. In response to these issues, Physical Optics Corporation (POC) evaluated a new optical I/O 'pin' and pin grid array concept for two

Limitations: APPROVED FOR PUBLIC RELEASE
Description: Final rept. Apr 95-Jan 96
Pages: 34
Report Date: JAN 1996
Contract Number: F29601-95-C-0097
Report Number: B505112
Keywords relating to this report:
ARRAYS
CHIPS(ELECTRONICS)
CIRCUIT INTERCONNECTIONS
COUNTING METHODS
CROSSTALK
DATA RATE
EDGES
ELECTROMAGNETIC INTERFERENCE
GRIDS
HIGH RATE
INPUT OUTPUT DEVICES
INPUT OUTPUT PROCESSING
LAYERS
LOW COSTS
MODULES(ELECTRONICS)
OPTICAL CIRCUITS
OPTICAL LENSES
PHOTODIODES
SENSITIVITY
SIZES(DIMENSIONS)
VERY LARGE SCALE INTEGRATION
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