Abstract: Solute effect on the creep resistance of two-phase lamellar TiAl with an ultrafine microstructure creep- deformed in a low-stress (LS) creep regime WHERE A NEARLY LINEAR CREEP BEHAVIOR WAS OBSERVED has been investigated. The resulted deformation substructure and in-situ TEM experiment reveals that interface sliding by the motion of preexisting interfacial dislocations is the predominant deformation mechanism in LS creep regime. Solute segregation at interfaces and interfacial precipitation caused by the segregation result in an increase of creep resistance in LS creep regime.
| Limitations: |
 APPROVED FOR PUBLIC RELEASE |
| Description: |
Conference proceedings |
| Pages: |
7 |
| Report Date: |
2003 |
| Contract Number: |
W7405ENG48 |
| Report Number: |
P082410 |
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