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Abstract:
maintenance of high voltage equipment is since ever a critical point that, with the increasing cost of high graded components, can well reduce the margin of profit of Industry when repairing must occur. The BN100 superior thermal conductive and lightweight filler technology is a new filler technology, that not only lets Users a full access for maintenance because cure-free being compounded by loose Boron Nitride powder mechanically compressed and without resin, but also permits to much increase the thermal dissipation because of a K value of about 10 W/mK. Under this ESA contract we have demonstrated that hot spot temperatures can drop as much as 20 degrees - 50 degrees depending on the power, opening a new way for more compacted packaging, higher power density PCBs and COTS acceptance in Space missions.
| Limitations: |
 APPROVED FOR PUBLIC RELEASE |
| Pages: |
29 |
| Report Date: |
13 JUL 2005 |
| Report Number: |
A014544 |
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